Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11831093 | Socket locator | Matthew J. Traverso, Sandeep Razdan | 2023-11-28 |
| 11756861 | Thermal packaging with fan out wafer level processing | Ashley J.M. ERICKSON, Matthew J. Traverso, Sandeep Razdan, Aparna R. PRASAD | 2023-09-12 |