Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11680193 | Low-temperature heat-curable adhesive composition for structure | Daisuke Makino, Atsuhiko SUZUKI, Motoyasu Asakawa, Katsuya Himuro, Kenichi Yamamoto | 2023-06-20 |
YM
Yusuke MURACHI
Cemedine Co.: 1 patents #3 of 15Top 20%
Overall (2023): #188,107 of 537,848Top 35%
1
Patents 2023