Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11680193 | Low-temperature heat-curable adhesive composition for structure | Daisuke Makino, Yusuke MURACHI, Motoyasu Asakawa, Katsuya Himuro, Kenichi Yamamoto | 2023-06-20 |
| 11618839 | Structure adhesive composition exhibiting favorable thread breakage and capable of stitch coating | Daisuke Makino, Yuusuke Murachi, Katsutoshi Ando, Koji Oda | 2023-04-04 |