Issued Patents 2023
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11843547 | Allocating additional bandwidth to resources in a datacenter through deployment of dedicated gateways | Dileep K. Devireddy, Ganesh Sadasivan, Chidambareswaran Raman, Sreenivas Duvvuri | 2023-12-12 |
| 11816857 | Methods and apparatus for generating point cloud histograms | David J. Michael, Nitin M. Vaidya | 2023-11-14 |
| 11810314 | System and method for refining dimensions of a generally cuboidal 3D object imaged by 3D vision system and controls for the same | Nitin M. Vaidya, Daniel Moreno, Ben R. Carey, Nickolas J. Mullan, Gilbert Chiang +2 more | 2023-11-07 |
| 11805051 | Allocating additional bandwidth to resources in a datacenter through deployment of dedicated gateways | Ganesh Sadasivan, Chidambareswaran Raman, Dileep K. Devireddy, Sreenivas Duvvuri | 2023-10-31 |
| 11799761 | Scaling edge services with minimal disruption | Yong Wang, Xinhua Hong | 2023-10-24 |
| 11729095 | Allocating additional bandwidth to resources in a datacenter through deployment of dedicated gateways | Ganesh Sadasivan, Chidambareswaran Raman, Dileep K. Devireddy, Sreenivas Duvvuri | 2023-08-15 |
| 11605177 | System and method for refining dimensions of a generally cuboidal 3D object imaged by 3D vision system and controls for the same | Ben R. Carey, Nickolas J. Mullan, Gilbert Chiang, Yukang Liu, Nitin M. Vaidya +2 more | 2023-03-14 |
| 11582147 | Allocating additional bandwidth to resources in a datacenter through deployment of dedicated gateways | Chidambareswaran Raman, Ganesh Sadasivan, Dileep K. Devireddy, Sreenivas Duvvuri | 2023-02-14 |
| 11567741 | Memory compiler techniques | Mouli Rajaram Chollangi, Sriram Thyagarajan, Yew Keong Chong, Pratik Ghanshambhai Satasia | 2023-01-31 |
| 11560892 | Multi-stage compressor and air conditioner having a linkage between the vanes of the different stages | Dahao Wang, Huijun Wei, Jing-Meng Liu | 2023-01-24 |
| 11562502 | System and method for calibrating a plurality of 3D sensors with respect to a motion conveyance | Aaron S. Wallack, Gang Liu, Robert A. Wolff, David J. Michael, Ruibing Wang | 2023-01-24 |