Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11610801 | Laser-releasable bonding materials for 3-D IC applications | Arthur O. Southard, Qi Wu, Xiao Liu | 2023-03-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11610801 | Laser-releasable bonding materials for 3-D IC applications | Arthur O. Southard, Qi Wu, Xiao Liu | 2023-03-21 |