Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11840047 | Metal-clad laminate, printed circuit board, and method for manufacturing the same | Shi-Ing Huang, Shur-Fen Liu | 2023-12-12 |
| 11573077 | Scatterometry based methods and systems for measurement of strain in semiconductor structures | Houssam Chouaib, Aaron Rosenberg, Dawei Hu, Zhengquan Tan | 2023-02-07 |