TW

Te Yu Wei

Basf Se: 1 patents #154 of 752Top 25%
Overall (2023): #231,704 of 537,848Top 45%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11725117 Chemical mechanical polishing of substrates containing copper and ruthenium Haci Osman GUEVENC, Michael Lauter, Wei-Lan Chiu, Reza Golzarian, Julian Proelss +1 more 2023-08-15