Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11725117 | Chemical mechanical polishing of substrates containing copper and ruthenium | Haci Osman GUEVENC, Michael Lauter, Te Yu Wei, Wei-Lan Chiu, Julian Proelss +1 more | 2023-08-15 |