Issued Patents 2023
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11835758 | Packaging for microLEDs for chip to chip communication | Robert Kalman, Alex Tselikov | 2023-12-05 |
| 11824590 | Interconnect networks using microLED-based optical links | Robert Kalman, Alexander Tselikov, Cameron Danesh | 2023-11-21 |
| 11822138 | Integration of OE devices with ICs | Robert Kalman, Cameron Danesh, Alexander Tselikov | 2023-11-21 |
| 11822135 | Multi-array parallel optical links | Robert Kalman, Alexander Tselikov | 2023-11-21 |
| 11815712 | Multi-layer planar waveguide interconnects | Robert Kalman, Alexander Tselikov, Cameron Danesh | 2023-11-14 |
| 11810995 | P-type doping in GaN LEDs for high speed operation at low current densities | Cameron Danesh | 2023-11-07 |
| 11791901 | Coherent fiber bundle parallel optical links | Robert Kalman, Alexander Tselikov, Cameron Danesh | 2023-10-17 |
| 11791896 | High speed and multi-contact LEDs for data communication | Robert Kalman, Alex Tselikov | 2023-10-17 |
| 11764878 | LED chip-to-chip vertically launched optical communications with optical fiber | Robert Kalman, Alexander Tselikov, Cameron Danesh | 2023-09-19 |
| 11728894 | Optically-enhanced multichip packaging | Robert Kalman, Alexander Tselikov, Cameron Danesh | 2023-08-15 |
| 11677472 | Hybrid integration of microLED interconnects with ICs | Robert Kalman, Alexander Tselikov, Cameron Danesh | 2023-06-13 |
| 11624882 | Optical interconnects using microLEDs | Robert Kalman | 2023-04-11 |
| 11619781 | Embedding LEDs with waveguides | Robert Kalman, Alexander Tselikov, Cameron Danesh | 2023-04-04 |
| 11605618 | LED array for in-plane optical interconnects | Michael R. Krames, Robert Kalman, Cameron Danesh | 2023-03-14 |