| 11835758 |
Packaging for microLEDs for chip to chip communication |
Bardia Pezeshki, Alex Tselikov |
2023-12-05 |
| 11824590 |
Interconnect networks using microLED-based optical links |
Bardia Pezeshki, Alexander Tselikov, Cameron Danesh |
2023-11-21 |
| 11822138 |
Integration of OE devices with ICs |
Bardia Pezeshki, Cameron Danesh, Alexander Tselikov |
2023-11-21 |
| 11822135 |
Multi-array parallel optical links |
Bardia Pezeshki, Alexander Tselikov |
2023-11-21 |
| 11815712 |
Multi-layer planar waveguide interconnects |
Bardia Pezeshki, Alexander Tselikov, Cameron Danesh |
2023-11-14 |
| 11791896 |
High speed and multi-contact LEDs for data communication |
Bardia Pezeshki, Alex Tselikov |
2023-10-17 |
| 11791901 |
Coherent fiber bundle parallel optical links |
Bardia Pezeshki, Alexander Tselikov, Cameron Danesh |
2023-10-17 |
| 11764878 |
LED chip-to-chip vertically launched optical communications with optical fiber |
Bardia Pezeshki, Alexander Tselikov, Cameron Danesh |
2023-09-19 |
| 11728894 |
Optically-enhanced multichip packaging |
Bardia Pezeshki, Alexander Tselikov, Cameron Danesh |
2023-08-15 |
| 11677472 |
Hybrid integration of microLED interconnects with ICs |
Bardia Pezeshki, Alexander Tselikov, Cameron Danesh |
2023-06-13 |
| 11624882 |
Optical interconnects using microLEDs |
Bardia Pezeshki |
2023-04-11 |
| 11619781 |
Embedding LEDs with waveguides |
Bardia Pezeshki, Alexander Tselikov, Cameron Danesh |
2023-04-04 |
| 11605618 |
LED array for in-plane optical interconnects |
Michael R. Krames, Bardia Pezeshki, Cameron Danesh |
2023-03-14 |