Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11778752 | Circuit board with embedded electronic component and method for manufacturing the same | MING-JAAN HO, FU-YUN SHEN | 2023-10-03 |
| 11672100 | Heat equalization plate and method for manufacturing the same | FU-YUN SHEN, MING-JAAN HO | 2023-06-06 |
| 11665833 | Circuit board and manufacturing method thereof | MING-JAAN HO, XIAN-QIN HU, FU-YUN SHEN, Yong-Chao Wei | 2023-05-30 |