Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11778752 | Circuit board with embedded electronic component and method for manufacturing the same | HSIAO-TING HSU, MING-JAAN HO | 2023-10-03 |
| 11765818 | Method for manufacturing transmission circuit board | Wen-Zhu Wei, MING-JAAN HO | 2023-09-19 |
| 11700685 | Method for manufacturing the same | XIAN-QIN HU | 2023-07-11 |
| 11672100 | Heat equalization plate and method for manufacturing the same | HSIAO-TING HSU, MING-JAAN HO | 2023-06-06 |
| 11665833 | Circuit board and manufacturing method thereof | MING-JAAN HO, XIAN-QIN HU, HSIAO-TING HSU, Yong-Chao Wei | 2023-05-30 |