Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11646229 | Processing method of device wafer | — | 2023-05-09 |
| 11557465 | Electrostatic chuck | Yutaka MOMIYAMA, Hitoshi Sasaki, Tsukasa Shigezumi | 2023-01-17 |
| 11557467 | Electrostatic chuck | Yutaka MOMIYAMA, Hitoshi Sasaki, Tsukasa Shigezumi | 2023-01-17 |