Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798845 | Methods and apparatus for low resistivity and stress tungsten gap fill | Xi Cen, Kai Wu, Min Heon, Wei Min Chan, Peiqi WANG +4 more | 2023-10-24 |
| 11637107 | Silicon-containing layer for bit line resistance reduction | Nobuyuki Sasaki, Jianxin Lei, Wenting Hou, Rongjun Wang, Tza-Jing Gung | 2023-04-25 |
| 11626410 | Silicon-containing layer for bit line resistance reduction | Nobuyuki Sasaki, Jianxin Lei, Wenting Hou, Rongjun Wang, Tza-Jing Gung | 2023-04-11 |