Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11610807 | Methods and apparatus for cleaving of semiconductor substrates | Felix Deng, Yueh Sheng Ow, Tuck Foong Koh, Nuno Yen-Chu Chen, Yuichi Wada +1 more | 2023-03-21 |
| 11569122 | Methods and apparatus for cleaving of semiconductor substrates | Felix Deng, Yueh Sheng Ow, Tuck Foong Koh, Nuno Yen-Chu Chen, Yuichi Wada +1 more | 2023-01-31 |