Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11557499 | Methods and apparatus for prevention of component cracking using stress relief layer | Yuichi Wada, Chul Nyoung Lee, Siew Kit Hoi, Xinxin Wang, Zheng Min Clarence Chong +2 more | 2023-01-17 |