Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784033 | Methods and apparatus for processing a substrate | Mengxue Wu, Siew Kit Hoi, Jay Min Soh, Yue Cui, Palaniappan Chidambaram +1 more | 2023-10-10 |
| 11557499 | Methods and apparatus for prevention of component cracking using stress relief layer | Yuichi Wada, Kok Wei Tan, Siew Kit Hoi, Xinxin Wang, Zheng Min Clarence Chong +2 more | 2023-01-17 |