Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11815470 | Multi-perspective wafer analysis | Haim Feldman, Eyal NEISTEIN, Harel Ilan, Shahar Arad, Ori Golani | 2023-11-14 |
| 11803961 | Die-to-multi-die wafer inspection | Ron Naftali, Yariv Simovitch, Guy Shwartz | 2023-10-31 |
| 11713964 | Cathodoluminescence focal scans to characterize 3D NAND CH profile | David Goldovsky, Ronny Barnea | 2023-08-01 |
| 11688055 | Methods and systems for analysis of wafer scan data | Guy Shwartz | 2023-06-27 |
| 11662324 | Three-dimensional surface metrology of wafers | Ron Bar-Or, Lior Yaron | 2023-05-30 |