Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11803961 | Die-to-multi-die wafer inspection | Ron Naftali, Yariv Simovitch, Ido Almog | 2023-10-31 |
| 11688055 | Methods and systems for analysis of wafer scan data | Ido Almog | 2023-06-27 |