Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11587809 | Wafer supporting mechanism and method for wafer dicing | Bo Chen, Yan-Ting Shen, Wen-Pin Huang | 2023-02-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11587809 | Wafer supporting mechanism and method for wafer dicing | Bo Chen, Yan-Ting Shen, Wen-Pin Huang | 2023-02-21 |