Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11587809 | Wafer supporting mechanism and method for wafer dicing | Yan-Ting Shen, Fu Tang Chu, Wen-Pin Huang | 2023-02-21 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11587809 | Wafer supporting mechanism and method for wafer dicing | Yan-Ting Shen, Fu Tang Chu, Wen-Pin Huang | 2023-02-21 |