Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854842 | Substrate heat treatment apparatus | Hui Wang, Jun Wu, Wenjun Wang, Fuping Chen, Zhiyou Fang | 2023-12-26 |
| 11781235 | Plating apparatus and plating method | Yinuo Jin, Jian Wang, Hui Wang | 2023-10-10 |