Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728259 | Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same | Sungjin Kim, Jincheol KIM | 2023-08-15 |
| 11652039 | Packaging substrate with core layer and cavity structure and semiconductor device comprising the same | Sungjin Kim, Jincheol KIM, Byungkyu Jang | 2023-05-16 |