Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652039 | Packaging substrate with core layer and cavity structure and semiconductor device comprising the same | Sungjin Kim, Youngho Rho, Jincheol KIM | 2023-05-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652039 | Packaging substrate with core layer and cavity structure and semiconductor device comprising the same | Sungjin Kim, Youngho Rho, Jincheol KIM | 2023-05-16 |