Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495494 | Methods for reducing contact depth variation in semiconductor fabrication | Chen-Ming Lee, Fu-Kai Yang, Yi-Jyun Huang, Sheng-Hsiung Wang, Mei-Yun Wang | 2022-11-08 |
| 11362003 | Prevention of contact bottom void in semiconductor fabrication | Chung-Ting Ko, Chen-Ming Lee, Mei-Yun Wang, Fu-Kai Yang | 2022-06-14 |