Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495494 | Methods for reducing contact depth variation in semiconductor fabrication | Yun Lee, Chen-Ming Lee, Fu-Kai Yang, Sheng-Hsiung Wang, Mei-Yun Wang | 2022-11-08 |
| 11398559 | Mitigation of time dependent dielectric breakdown | Bao-Ru Young, Tung-Heng Hsieh | 2022-07-26 |