Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502076 | Semiconductor structure cutting process and structures formed thereby | Ryan Chia-Jen Chen, Cheng-Chung Chang, Shao-Hua Hsu, Ming-Ching Chang, Li-Wei Yin +2 more | 2022-11-15 |
| 11473486 | Fluid connector assembly, liquid cooling system and fluid circulation system | Yu-Jei HUANG | 2022-10-18 |
| 11456182 | Integrated circuit structure and fabrication thereof | Chang-Ching Yeh | 2022-09-27 |
| 11387105 | Loading effect reduction through multiple coat-etch processes | Jin-Dah Chen, Ming-Feng Shieh, Han-Wei Wu, Po-Chun Liu, Stan Chen | 2022-07-12 |
| 11297734 | Heat dissipation module for optical transceiver | — | 2022-04-05 |