Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502028 | Semiconductor package including a wire and a method of fabricating the semiconductor package | Jong Hoon Kim | 2022-11-15 |
| 11444063 | Semiconductor package including vertical interconnector | Ki Jun SUNG | 2022-09-13 |
| 11222872 | Semiconductor package including stacked semiconductor chips | Bok Kyu CHOI | 2022-01-11 |