Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495545 | Semiconductor package including a bridge die | Jong Hoon Kim, Ki Bum Kim | 2022-11-08 |
| 11444063 | Semiconductor package including vertical interconnector | Chae Sung LEE | 2022-09-13 |
| 11322446 | System-in-packages including a bridge die | Jong Hoon Kim, Ki Bum Kim | 2022-05-03 |