Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515254 | Semiconductor chip including penetrating electrodes, and semiconductor package including the semiconductor chip | Ki Bum Kim | 2022-11-29 |
| 11430763 | Semiconductor packages including stack modules comprised of interposing bridges and semiconductor dies | Kyoung Tae EUN | 2022-08-30 |
| 11342315 | Stack packages including through mold via structures | Juil Eom, Jae-Hoon Lee, Jin-Woo Park | 2022-05-24 |
| 11264319 | Storage system including a decoupling device having a plurality of unit capacitors | — | 2022-03-01 |
| 11222872 | Semiconductor package including stacked semiconductor chips | Chae Sung LEE | 2022-01-11 |
| 11217564 | Stack packages with interposer bridge | — | 2022-01-04 |