Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430763 | Semiconductor packages including stack modules comprised of interposing bridges and semiconductor dies | Bok Kyu CHOI | 2022-08-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430763 | Semiconductor packages including stack modules comprised of interposing bridges and semiconductor dies | Bok Kyu CHOI | 2022-08-30 |