Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495488 | Method for manufacturing bonded SOI wafer and bonded SOI wafer | Toshikazu Imai, Kazuhiko Yoshida, Miho NIITANI, Osamu Ishikawa | 2022-11-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495488 | Method for manufacturing bonded SOI wafer and bonded SOI wafer | Toshikazu Imai, Kazuhiko Yoshida, Miho NIITANI, Osamu Ishikawa | 2022-11-08 |