Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495488 | Method for manufacturing bonded SOI wafer and bonded SOI wafer | Kazuhiko Yoshida, Miho NIITANI, Taishi WAKABAYASHI, Osamu Ishikawa | 2022-11-08 |
| D951212 | Semiconductor device | Takeshi Imamura, Kazuma Yoshida, Ryosuke Okawa | 2022-05-10 |
| D951213 | Semiconductor device | Takeshi Imamura, Kazuma Yoshida, Ryosuke Okawa | 2022-05-10 |
| D951214 | Semiconductor device | Takeshi Imamura, Kazuma Yoshida, Ryosuke Okawa | 2022-05-10 |
| D951215 | Semiconductor device | Takeshi Imamura, Kazuma Yoshida, Ryosuke Okawa | 2022-05-10 |