Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495488 | Method for manufacturing bonded SOI wafer and bonded SOI wafer | Toshikazu Imai, Miho NIITANI, Taishi WAKABAYASHI, Osamu Ishikawa | 2022-11-08 |
| D965716 | Golf club accessory | — | 2022-10-04 |