Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515326 | Three-dimensional memory device including laterally-undulating memory material layers and methods for forming the same | Tatsuya Hinoue | 2022-11-29 |
| 11361816 | Memory block with separately driven source regions to improve performance | Rajdeep Gautam, Hardwell Chibvongodze | 2022-06-14 |
| 11355437 | Three-dimensional memory device including bump-containing bit lines and methods for manufacturing the same | Yukihiro Sakotsubo | 2022-06-07 |
| 11342245 | Through-stack contact via structures for a three-dimensional memory device and methods of forming the same | Hirofumi TOKITA | 2022-05-24 |
| 11335671 | Stacked die assembly including double-sided inter-die bonding connections and methods of forming the same | Hardwell Chibvongodze, Rajdeep Gautam | 2022-05-17 |
| 11302714 | Three-dimensional memory device including a composite semiconductor channel and a horizontal source contact layer and method of making the same | Satoshi Shimizu, Yanli Zhang | 2022-04-12 |
| 11244958 | Three-dimensional memory device including composite word lines and multi-strip select lines and method for making the same | Fei Zhou, Raghuveer S. Makala | 2022-02-08 |
| 11222954 | Three-dimensional memory device containing inter-select-gate electrodes and methods of making the same | Hardwell Chibvongodze, Masatoshi Nishikawa | 2022-01-11 |