Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398488 | Three-dimensional memory device including through-memory-level via structures and methods of making the same | Takaaki Iwai, Yoshitaka Otsu | 2022-07-26 |
| 11367736 | Through-stack contact via structures for a three-dimensional memory device and methods of forming the same | Takayuki MAEKURA, Romain Mentek | 2022-06-21 |
| 11355506 | Through-stack contact via structures for a three-dimensional memory device and methods of forming the same | Takayuki MAEKURA, Romain Mentek | 2022-06-07 |
| 11342245 | Through-stack contact via structures for a three-dimensional memory device and methods of forming the same | Zhixin Cui | 2022-05-24 |