Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11367736 | Through-stack contact via structures for a three-dimensional memory device and methods of forming the same | Hirofumi TOKITA, Takayuki MAEKURA | 2022-06-21 |
| 11355506 | Through-stack contact via structures for a three-dimensional memory device and methods of forming the same | Hirofumi TOKITA, Takayuki MAEKURA | 2022-06-07 |