Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410935 | Semiconductor package using cavity substrate and manufacturing methods | JeongByung Chae, DongJoo Park, ByoungWoo Cho, SeHwan Hong | 2022-08-09 |
| 11217556 | Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same | Tongbi Jiang | 2022-01-04 |