Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410935 | Semiconductor package using cavity substrate and manufacturing methods | Young Do Kweon, DongJoo Park, ByoungWoo Cho, SeHwan Hong | 2022-08-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410935 | Semiconductor package using cavity substrate and manufacturing methods | Young Do Kweon, DongJoo Park, ByoungWoo Cho, SeHwan Hong | 2022-08-09 |