Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11422104 | Exposed wire-bonding for sensing liquid and water in electronic devices | Caleb C. Han, Brad G. Boozer, David MacNeil, Gregory B. Arndt, Patrick E. O'Brien +7 more | 2022-08-23 |
| 11398457 | Packaged integrated circuit devices with through-body conductive vias, and methods of making same | Yong Poo Chia | 2022-07-26 |
| 11217556 | Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same | Young Do Kweon | 2022-01-04 |