Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398457 | Packaged integrated circuit devices with through-body conductive vias, and methods of making same | Tongbi Jiang | 2022-07-26 |
YC
Yong Poo Chia
Overall (2022): #199,428 of 548,613Top 40%
1
Patents 2022