Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398420 | Semiconductor package having core member and redistribution substrate | Kyungdon Mun, Myungsam Kang, Youngchan Ko, Jeongseok Kim, Gongje Lee +1 more | 2022-07-26 |
YK
Yieok Kwon
Overall (2022): #200,947 of 548,613Top 40%
1
Patents 2022