Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538737 | Semiconductor package | Myungsam Kang, Youngchan Ko | 2022-12-27 |
| 11398420 | Semiconductor package having core member and redistribution substrate | Myungsam Kang, Youngchan Ko, Yieok Kwon, Jeongseok Kim, Gongje Lee +1 more | 2022-07-26 |
| 11342274 | Semiconductor package | Sangkyu Lee, Jingu Kim, Shanghoon Seo, Jeongho Lee | 2022-05-24 |