Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398420 | Semiconductor package having core member and redistribution substrate | Kyungdon Mun, Myungsam Kang, Youngchan Ko, Yieok Kwon, Gongje Lee +1 more | 2022-07-26 |
| 11388361 | Image sensor, imaging device including image sensor, and method of operating imaging device | Seol Namgung, Seungnam Choi, Junseok Kim, Jongwoo Bong, Yunjae Suh | 2022-07-12 |