Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515225 | Reconstituted wafer including mold material with recessed conductive feature | Nathaniel P. Wyckoff, Brandon C. Hamilton, Bret W. Simon, Jacob R. Mauermann | 2022-11-29 |
| 11326246 | Controlled warping of shadow mask tooling for improved reliability and miniturization via thin film deposition | Nathaniel P. Wyckoff, Jacob R. Mauermann, Bret W. Simon, Carlen R. Welty | 2022-05-10 |
| 11236436 | Controlled induced warping of electronic substrates via electroplating | Nathaniel P. Wyckoff, Brandon C. Hamilton, Jacob R. Mauermann, Carlen R. Welty | 2022-02-01 |
| 11239182 | Controlled induced warping of electronic substrates | Nathaniel P. Wyckoff, Brandon C. Hamilton, Jacob R. Mauermann, Carlen R. Welty | 2022-02-01 |