Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515225 | Reconstituted wafer including mold material with recessed conductive feature | Richard Korneisel, Nathaniel P. Wyckoff, Brandon C. Hamilton, Jacob R. Mauermann | 2022-11-29 |
| 11502060 | Microelectronics package with enhanced thermal dissipation | Reginald D. Bean, Russell C. Tawney, Ross K. Wilcoxon | 2022-11-15 |
| 11326246 | Controlled warping of shadow mask tooling for improved reliability and miniturization via thin film deposition | Richard Korneisel, Nathaniel P. Wyckoff, Jacob R. Mauermann, Carlen R. Welty | 2022-05-10 |
| 11276641 | Conformal multi-plane material deposition | Kyle B. Snyder, Nathaniel P. Wyckoff, Brandon C. Hamilton, Alexander S. Warren | 2022-03-15 |