Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515225 | Reconstituted wafer including mold material with recessed conductive feature | Richard Korneisel, Nathaniel P. Wyckoff, Bret W. Simon, Jacob R. Mauermann | 2022-11-29 |
| 11474576 | Electrical device with thermally controlled performance | Alan P. Boone, Kyle B. Snyder, Bryan M. Jefferson | 2022-10-18 |
| 11469373 | System and device including memristor material | Kyle B. Snyder, Nathaniel P. Wyckoff, Bruce Rowenhorst, Steven J. Wiebers | 2022-10-11 |
| 11462267 | System and device including memristor material | Kyle B. Snyder, Nathaniel P. Wyckoff, Bruce Rowenhorst, Steven J. Wiebers | 2022-10-04 |
| 11456418 | System and device including memristor materials in parallel | Kyle B. Snyder, Nathaniel P. Wyckoff, Bruce Rowenhorst, Steven J. Wiebers | 2022-09-27 |
| 11276641 | Conformal multi-plane material deposition | Kyle B. Snyder, Nathaniel P. Wyckoff, Bret W. Simon, Alexander S. Warren | 2022-03-15 |
| 11239182 | Controlled induced warping of electronic substrates | Richard Korneisel, Nathaniel P. Wyckoff, Jacob R. Mauermann, Carlen R. Welty | 2022-02-01 |
| 11236436 | Controlled induced warping of electronic substrates via electroplating | Richard Korneisel, Nathaniel P. Wyckoff, Jacob R. Mauermann, Carlen R. Welty | 2022-02-01 |
| 11233030 | Microfluidic manufactured mesoscopic microelectronics interconnect | Kyle B. Snyder, Alan P. Boone | 2022-01-25 |