Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532588 | Copper paste for pressureless bonding, bonded body and semiconductor device | Hideo Nakako, Kazuhiko Kurafuchi, Dai Ishikawa, Chie Sugama, Yuki KAWANA | 2022-12-20 |
| 11512214 | Composition containing organic solvents with different vapor pressures, conductor made from composition, method for manufacturing conductor, and structure comprising conductor | Kohsuke URASHIMA, Takaaki NOHDOH, Motoki YONEKURA, Ryuji Akebi | 2022-11-29 |
| 11483936 | Method for producing joined body, and joining material | Hideo Nakako, Dai Ishikawa, Chie Sugama, Yuki KAWANA, Motohiro NEGISHI +1 more | 2022-10-25 |
| 11462502 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device | Yuki KAWANA, Hideo Nakako, Motohiro NEGISHI, Dai Ishikawa, Chie Sugama | 2022-10-04 |
| 11370066 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device | Yuki KAWANA, Hideo Nakako, Motohiro NEGISHI, Dai Ishikawa, Chie Sugama | 2022-06-28 |