Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532588 | Copper paste for pressureless bonding, bonded body and semiconductor device | Hideo Nakako, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki KAWANA | 2022-12-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532588 | Copper paste for pressureless bonding, bonded body and semiconductor device | Hideo Nakako, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki KAWANA | 2022-12-20 |