Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11483936 | Method for producing joined body, and joining material | Hideo Nakako, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki KAWANA +1 more | 2022-10-25 |
| 11462502 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device | Yuki KAWANA, Hideo Nakako, Dai Ishikawa, Chie Sugama, Yoshinori Ejiri | 2022-10-04 |
| 11370066 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device | Yuki KAWANA, Hideo Nakako, Dai Ishikawa, Chie Sugama, Yoshinori Ejiri | 2022-06-28 |